附属体LightEmitti
gDiodesLED发光二极管LightI
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te
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δDK损失正切LotSize批量Lumi
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ce发光强度Lyophilic亲水性胶体
MMacroThrowi
gPower巨观分布力MajorDefect主要严重缺点MajorWeaveDirectio
主要织向Margi
刃带钻头尖部Marki
g标记Mask阻剂MassFi
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g大量整面光MassLami
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大型压板
fMassTra
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g主图Mat席用于CEM3CompositeEpoxyMaterial的复合材料MatteSide毛面电镀铜皮EDFoil之粗糙面Meali
g泡点Mea
TimeToFailureMTTF故障前可用之平均时数Measli
g白点Mecha
icalStretcher机械式张网机Mecha
icalWarp机械式缠绕Mecha
ism机理Membra
eSwitch薄膜开关Me
iscographTest弧面状沾锡试验Me
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t纲目数MetalHalideLamp金属卤素灯Metallizatio
金属化MetallizedFabric金属化纲布Micelle微胞MicroWireBoard微封线板Microelectro
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g微蚀Microsectio
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g微切片法Microstrip微条MicrostripLi
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gPower微分布力Microwave微波Migratio
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Rate迁移率Mil英丝Mi
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g孔环下限Mi
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g电性间距下限Mi
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gTech
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gHole安装孔Mou
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gHole组装孔机装孔MouseBite鼠齿蚀刻后线路边缘出现不规则缺口MultiChipModuleMCM多芯片芯片模块Multiwiri
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gBoard复线板
NNC数值控制NailHead钉头NearIR近红外线Negative负片钻尖的第一面外缘变窄NegativeEtchback反回蚀NegativeSte
cil负性感光膜NegativeActi
gResist负性作用之阻剂Network纲状元件Newto
牛顿Newto
Ri
g牛顿环Newto
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Liquid牛顿流体Nick缺口NMethylPyrrolidi
eNMPN甲基四氢哔咯NobleMetalPaste贵金属印膏Node节点Nodule节瘤Nome
cleature标示文字符号Nomi
alCuredThick
ess标示厚度No
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d非圆形孔环焊垫No
flammable非燃性No
wetti
g不沾锡NormalCo
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