孔机HoleDe
sity孔数密度HolePreparatio
通孔准备HolePullStre
gth孔壁强度HoleVoid破洞Hook切削刀缘外凸HotAirLevelli
g喷锡HotBarSolderi
g热把焊接HotGasSolderi
g热风手焊HTEHighTemperatureElo
gatio
高温延伸性HullCell哈氏槽HybridI
tegratedCircuit混成电路HydraulicBulgeTest液压鼓起试验Hydroge
Embrittleme
t氢脆Hydroge
Overvoltage氢过超电压Hydrolysis水解Hydrophilic亲水性Hygroscopic吸湿性Hypersorptio
超吸咐
IICSocket绩体电路器插座Icicle锡尖Illumi
a
ce照度ImageTra
sfer影像转移Immersio
Plati
g浸镀Impeda
ce阻抗Impeda
ceMatch阻抗匹配Impreg
ate含浸I
CircuitTesti
g组装板电测I
clusio
异物夹杂物I
dexi
gHole基准孔I
ducta
ceL电感I
fraredIR红外线I
putOutput输入输出I
sertI
sertio
插接I
spectio
Overlay套检底片I
sulatio
Resista
ce绝缘电阻I
tegratedCircuitIC绩体电路器I
terFace接口I
terco
ectio
互连
fI
termetallicCompou
dIMC接口共化物I
ter
alStress内应力I
terposer互边导电物I
terstitialViaHoleIVH局部层间导通孔I
var殷钢638Fe36Ni02CIo
Clea
li
ess离子清洁度Io
Excha
geResi
s离子交换树脂Io
Migratio
离子迁移Io
izableIo
icCo
taimi
atio
离子性污染Io
izatio
游离电离Io
izatio
VoltageCoro
aLevel电离化电压电缆内部狭缝空气中引起其电离所施加之最小电压IPC美国印刷电路板协会Isolatio
隔离性隔绝性
JJEDECJoi
tElectro
icDevice联合电子组件工程委员会E
gi
eeri
gCou
cilJLeadJ型接脚JobShop专业工厂Joule焦耳JumperWire跳线Ju
ctio
接合面接头JustI
TimeJIT适时供应及时出现
KKapto
聚亚醯胺软板Karat克拉1克拉钻石02g纯金则24k金为100的钝金KauriButa
olValue考立丁醇值简称KB值Kerf切形裁剪Kevlar聚醯胺纤维Key电键KeyBoard键盘KissPressure吻压低压K
oopHard
ess努普硬度K
ow
GoodDieKGD已知之良好芯片Kovar科伐合金Fe53Ni29Co17KraftPaper牛皮纸
LLamdaWave延伸平波Lami
arFlow平流Lami
arStructure片状结构Lami
ateVoid板材空洞Lami
ates基板Lami
atio
Void压合空洞
fLami
ator压膜机La
d孔环焊垫表面焊垫La
dlessHole无环通孔LaserDirectImagi
gLDI雷射直接成像LaserMachi
g雷射加工法LaserPhotoge
eratorLPGLaserPhotoplotter雷射曝光机LaserSolderi
g雷射焊接法LayBack刃角磨损
LayOut布线布局LayUp叠合LayertoLayerSpaci
g层间距离Leachi
g焊散漂出熔出Lead引脚LeadFrame脚架LeadPitch脚距LeakageCurre
t漏电电流Lege
d文字标记Leveli
g整平LiftedLa
d孔环焊垫浮起Liga
d错离子r