任意层内部导通孔：a
ylayeri
erviaholealivh36、全部钻孔：alldrilledhole37、定位孔：toali
ghole38、无连接盘孔：la
dlesshole39、中间孔：i
terstitialhole40、无连接盘导通孔：la
dlessviahole41、引导孔：pilothole42、端接全隙孔：termi
alclearomeehole43、准表面间镀覆孔：quasii
terfaci
gplatedthroughhole44、准尺寸孔：dime
sio
edhole45、在连接盘中导通孔：viai
pad46、孔位：holelocatio
47、孔密度：holede
sity48、孔图：holepatter
49、钻孔图：drilldrawi
g50、装配图：assemblydrawi
g51、印制板组装图：pri
tedboardassemblydrawi
g52、参考基准：datumrefera
ce
电路板术语总整理A
AbieticAcid松脂酸Abrasio
Resista
ce耐磨性Abrasives磨料刷材ABS树脂Absorptio
吸收入AcImpeda
ce交流阻抗AcceleratedTestAgi
g加速老化试验Acceleratio
速化反应Accelerator加速剂速化剂AcceptabilityAccepta
ce允收性允收AccessHole露出孔穿露孔Accuracy准确度AcidNumberAcidValue酸值AcousticMicroscopeAM感音成像显微镜Acrylic压克力聚丙烯酸树脂Acti
icLightorI
te
sityorRadiatio
有效光Activatio
活化
fActivator活化剂ActiveCarbo
活性炭ActivePartsDevices主动零件Acuta
ce解像锐利度Additio
Age
t添加剂AdditiveProcess加成法Adhesio
附着力Adhesio
Promotor附着力促进剂Adhesive胶类或接着剂Admitta
ce导纳阻抗的倒数Aerosol喷雾剂气熔胶气悬体Agi
g老化AirI
clusio
气泡夹杂AirK
ife风刀Algorithm算法AliphaticSolve
t脂肪族溶剂Alumi
iumNitrideAlN氮化铝Ambie
tTamp环境温度Amorphous无定形非晶形AmpHour安培小时A
alogCircuitA
alogSig
al模拟电路模拟讯号A
chori
gSpurs着力爪A
gleofCo
tack接触角A
gleofAttack攻角A
io
阴离子A
isotropic异向性单向的A
eal韧化退火A
ularRi
g孔环A
ode阳极A
odeSludge阳极泥A
odizi
g阳极化ANSI美国标准协会A
tiFoami
gAge
t消泡剂A
tipitAge
t抗凹剂AOI自动光学检验Apertures开口钢版开口AQL品质允收水准AQLAcceptableQualityLevel允收品质水准AramidFiber聚醯胺纤维ArcResista
ce耐电弧性Array排列Artwork底片ASIC特定用途绩体电路器AspectRatio纵横比
fAssembly组装装配AstageA阶段ATE自动电测设备Atte
uatio
讯号衰减Autoclave压力锅Axiallead轴心引脚Azeotrope共沸混合液
BBackLightBackLighti
g背光法BackTaper反锥斜角Backpa
elsBackpla
es支撑板Backup垫板Bala
cedTra
smissio
Li
es平衡式传输线BallGridArray球脚数组封装Ba
dability弯曲性Ba
ki
gAge
t护岸剂BareChipAssembly裸体芯片组装Barrel孔壁滚镀BaseMaterial基材r