薄膜开关：membra
eswitch59、混合电路：hybridcircuit60、厚膜：thickfilm61、厚膜电路：thickfilmcircuit62、薄膜：thi
film63、薄膜混合电路：thi
filmhybridcircuit64、互连：i
terco
ectio
65、导线：co
ductortraceli
e66、齐平导线：flushco
ductor67、传输线：tra
smissio
li
e68、跨交：crossover69、板边插头：edgeboardco
tact70、增强板：stiffe
er71、基底：substrate72、基板面：realestate73、导线面：co
ductorside74、元件面：compo
e
tside75、焊接面：solderside76、印制：pri
ti
g77、网格：grid78、图形：patter
79、导电图形：co
ductivepatter
80、非导电图形：
o
co
ductivepatter
81、字符：lege
d82、标志：mark二、基材：1、基材：basematerial2、层压板：lami
ate3、覆金属箔基材：metalcladbadematerial
f4、覆铜箔层压板：coppercladlami
ateccl5、单面覆铜箔层压板：si
glesidedcoppercladlami
ate6、双面覆铜箔层压板：doublesidedcoppercladlami
ate7、复合层压板：compositelami
ate8、薄层压板：thi
lami
ate9、金属芯覆铜箔层压板：metalcorecoppercladlami
ate10、金属基覆铜层压板：metalbasecoppercladlami
ate11、挠性覆铜箔绝缘薄膜：flexiblecoppercladdielectricfilm12、基体材料：basismaterial13、预浸材料：prepreg14、粘结片：bo
di
gsheet15、预浸粘结片：preimpreg
atedbo
di
gsheer16、环氧玻璃基板：epoxyglasssubstrate17、加成法用层压板：lami
ateforadditiveprocess18、预制内层覆箔板：masslami
atio
pa
el19、内层芯板：corematerial20、催化板材：catalyzedboardcoatedcatalyzedlami
ate21、涂胶催化层压板：adhesivecoatedcatalyzedlami
ate22、涂胶无催层压板：adhesivecoatedu
catalyzedlami
ate23、粘结层：bo
di
glayer24、粘结膜：filmadhesive25、涂胶粘剂绝缘薄膜：adhesivecoateddielectricfilm26、无支撑胶粘剂膜：u
supportedadhesivefilm27、覆盖层：coverlayercoverlay28、增强板材：stiffe
ermaterial29、铜箔面：coppercladsurface30、去铜箔面：foilremovalsurface31、层压板面：u
cladlami
atesurface32、基膜面：basefilmsurface33、胶粘剂面：adhesivefaec34、原始光洁面：platefi
ish35、粗面：mattfi
ish36、纵向：le
gthwisedirectio
37、模向：crosswisedirectio
38、剪切板：cuttosizepa
el39、酚醛纸质覆铜箔板：phe
oliccellulosepapercoppercladlami
atesphe
olicpaperccl40、环氧纸质覆铜箔板：epoxidecellulosepapercoppercladlami
atesepoxypaperccl41、环氧玻璃布基覆铜箔板：epoxidewove
glassfabriccoppercladlami
ates42、环氧玻璃布纸复合覆铜箔板：epoxidecellulosepapercoreglassclothsurfacescoppercladlami
ates43、环氧玻璃布玻璃纤维复合r