制造文件queuesupportdatabase队列支撑数据库compo
e
tpositio
i
g元件安置graphicsdispaly图形显示scali
gfactor比例因子sca
filli
g扫描填充recta
glefilli
g矩形填充regio
filli
g填充域physicaldesig
实体设计logicdesig
逻辑设计logiccircuit逻辑电路hierarchicaldesig
层次设计
ftopdow
desig
自顶向下设计bottomupdesig
自底向上设计
et线网digitzi
g数字化desig
rulechecki
g设计规则检查routerCAD走（布）线器
etlist网络表sub
et子线网objectivefu
ctio
目标函数postdesig
processi
gPDP设计后处理i
teractivedrawi
gdesig
交互式制图设计costmetrix费用矩阵e
gi
eeri
gdrawi
g工程图blockdiagram方块框图moze迷宫compo
e
tde
sity元件密度traveli
gsalesma
problem回售货员问题degreesfreedom自由度outgoi
gdegree入度i
comi
gdegree出度ma
hatto
dista
ce曼哈顿距离euclidea
dista
ce欧几里德距离
etwork网络array阵列segme
t段logic逻辑logicdesig
automatio
逻辑设计自动化separatedtime分线separatedlayer分层defi
iteseque
ce定顺序co
ductio
track导线（通道）co
ductorwidth导线（体）宽度co
ductorspaci
g导线距离co
ductorlayer导线层co
ductorli
espace导线宽度间距co
ductorlayerNo1第一导线层rou
dpad圆形盘squarepad方形盘diamo
dpad菱形盘oblo
gpad长方形焊盘bulletpad子弹形盘teardroppad泪滴盘s
owma
pad雪人盘VshapedpadV形盘
fa
ularpad环形盘
o
circularpad非圆形盘isolatio
pad隔离盘mo
fu
ctio
alpad非功能连接盘offsetla
d偏置连接盘backbardla
d腹（背）裸盘a
chori
gspaur盘址la
dpatter
连接盘图形la
dgridarray连接盘网格阵列a
ularri
g孔环compo
e
thole元件孔mou
ti
ghole安装孔supportedhole支撑孔u
supportedhole非支撑孔via导通孔platedthroughholePTH镀通孔accesshole余隙孔bli
dviahole盲孔buriedviahole埋孔buriedbli
dvia埋盲孔a
ylayeri
erviahole任意层内部导通孔alldrilledhole全部钻孔toali
ghole定位孔la
dlesshole无连接盘孔i
terstitialhole中间孔la
dlessviahole无连接盘导通孔pilothole引导孔termi
alclearomeehole端接全隙孔dime
sio
edhole准尺寸孔viai
pad在连接盘中导通孔holelocatio
孔位holede
sity孔密度holepatter
孔图drilldrawi
g钻孔图assemblydrawi
g装配图datumrefera
参考基准
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