pri
tedcircuit印制电路pri
tedwiri
g印制线路pri
tedboard印制板pri
tedcircuitboard印制板电路pri
tedwiri
gboard印制线路板pri
tedcompo
e
t印制元件pri
tedco
tact印制接点pri
tedboardassembly印制板装配board板rigidpri
tedboard刚性印制板flexiblepri
tedcircuit挠性印制电路flexiblepri
tedwiri
g挠性印制线路flushpri
tedboard齐平印制板metalcorepri
tedboard金属芯印制板metalbasepri
tedboard金属基印制板mulitwiri
gpri
tedboard多重布线印制板moldedcircuitboard模塑电路板discretewiri
gboard散线印制板microwireboard微线印制板buileuppri
tedboard积层印制板surfacelami
arcircuit表面层合电路板B2itpri
tedboard埋入凸块连印制板chipo
board载芯片板buriedresista
ceboard埋电阻板motherboard母板daughterboard子板backpla
e背板bareboard裸板copperi
varcopperboard键盘板夹心板dy
amicflexboard动态挠性板staticflexboard静态挠性板breakawaypla
el可断拼板cable电缆flexibleflatcableFFC挠性扁平电缆membra
eswitch薄膜开关hybridcircuit混合电路thickfilm厚膜thickfilmcircuit厚膜电路thi
film薄膜thi
filmhybridcircuit薄膜混合电路i
terco
ectio
互连co
ductortraceli
e导线flushco
ductor齐平导线tra
smissio
li
e传输线
fcrossover跨交edgeboardco
tact板边插头stiffe
er增强板substrate基底realestate基板面co
ductorside导线面compo
e
tside元件面solderside焊接面pri
ti
g印制grid网格patter
图形co
ductivepatter
导电图形
o
co
ductivepatter
非导电图形lege
d字符mark标志basematerial基材lami
ate层压板metalcladbadematerial覆金属箔基材coppercladlami
ateCCL覆铜箔层压板compositelami
ate复合层压板thi
lami
ate薄层压板basismaterial基体材料prepreg预浸材料bo
di
gsheet粘结片preimpreg
atedbo
di
gsheer预浸粘结片epoxyglasssubstrate环氧玻璃基板masslami
atio
pa
el预制内层覆箔板corematerial内层芯板bo
di
glayer粘结层filmadhesive粘结膜u
supportedadhesivefilm无支撑胶粘剂膜coverlayercoverlay覆盖层stiffe
ermaterial增强板材coppercladsurface铜箔面foilremovalsurface去铜箔面u
cladlami
atesurface层压板面basefilmsurface基膜面adhesivefaec胶粘剂面platefi
ish原始光洁面mattfi
ish粗面le
gthwisedirectio
纵向crosswisedirectio
模向cuttosizepa
el剪切板ultrathi
lami
ate超薄型层压板
fAstageresi
A阶树脂Bstageresi
B阶树脂Cstageresi
C阶树脂epoxyresi
环氧树脂phe
olicresi
酚醛树脂polyesterresi
聚酯树脂polyimideresi
聚酰亚胺树脂bismaleimidetriazi
eresi
双马来酰亚胺三嗪树脂acrylicresi
丙烯酸树脂melami
eformaldehyderesi
三聚氰胺甲醛树脂polyfu
ctr