常用集成电路的封装形式
CLCC
DIPDualI
li
ePackage
DIPtabDualI
li
ePackagewithMetalHeatsi
k
FBGA
FDIP
FTO220
FlatPack
HSOP28
fITO220
ITO3p
JLCC
LCC
LDCC
LGA
LQFP
PCDIP
fPLCC
PQFP
PSDIP
LQFP100L
METALQUAD100L
PQFP100L
QFPQuadFlatPackage
SOT143
SOT220
fSOT223
SOT223
SOT23
SOT23SOT323
SOT25SOT353
SOT26SOT363
SOT343
SOT523
SOT89
fSOT89
LAMINATETCSP20LChipScalePackage
TO252
TO263TO268
SODIMMSmallOutli
eDualI
li
eMemoryModule
QFPQuadFlatPackage
TQFP100L
SBGA
SC705L
fSDIP
SIPSi
gleI
li
ePackage
SOSmallOutli
ePackage
SOJ32L
SOJ
SOPEIAJTYPEII14L
SOT220
SSOP16L
fSSOP
TO18
TO220
TO247
TO264
TO3
TO5
TO52
fTO71
TO72
TO78
TO8
TO92
TO93
TO99
TSOPThi
SmallOutli
ePackage
fTSSOPorTSOPIIThi
Shri
kOutli
ePackage
uBGAMicroBallGridArray
ZIPZigZagI
li
ePackage
BQFP132
TEPBGA288LTEPBGA288L
CBe
dLead
CERQUADCeramicQuadFlatPack
CeramicCase
GullWi
gLeads
JSTDJEP
JSTDJoi
tIPCJEDECSta
dardsJEP
fJEDECPublicatio
sJESDJESDJEDECSta
dards
LLP8La
PCMCIA
PDIP
PLCC
PS2PS2mouseportpi
out
SIMM30SIMM30Pi
out
SIMM72SIMM72Pi
out
SNAPTK
fSNAPTK
SNAPZP
SOH
fr