全球旧事资料 分类
PCB介Age
da
Backgrou
dK
owledgeTra
smissio
Li
eTheoryPCBCrosssectio
i
troductio
PCBMateriala
dCopperThick
essPCBLayerStackupDesig
Flow
Desig
co
ditio
sa
dTargetMaterialCopperselectio
Defi
eotherparametersImpeda
cecalculatio

Backgrou
dK
owledge13
fBackgrou
dK
owledge23
PCBDesig
a
dProfitability
fFromLeeRitchey’s“RighttheFirstTime”VolI
Backgrou
dK
owledge33
Whya
dHowtodefi
ethetracewidth
fTra
smissio
Li
eTheory
Tra
smissio
Li
eAtra
smissio
li
eiscomposedofa
ytwoco
ductorsthathavele
gthSig
alPatha
dRetur
PathA
ycircuitle
gthatleast110thoftheedgeratemustbeco
sideredasatra
smissio
li
e
fTra
smissio
Li
eElectromag
eticProperties
Equivale
tCircuitModel
CharacteristicImpeda
ce
Propagatio
Equatio
TimeDelay
fTra
smissio
Li
e
Tra
smissio
Li
eStructure
Microstrip(微)
Stripli
e()
Tra
smissio
Li
e
Reflectio
a
dTra
smissio

fReflectio
Coefficie
t
Tra
smissio
Coefficie
t
PCBCrosssectio
i
troductio

fPCBMaterialThick
ess
CopperCladLami
ateCCLCOREThick
essmil3456810121415182021243132394447596231milwithoutCu≥31milwithCu
fPCBMaterialThick
ess
Copper
PCBLayerStackupDesig
Flow
fDesig
Flow
Desig
co
ditio
sa
dTargetDesig
co
ditio
sBoardsizeBoardlayersTotalThick
essDesig
TargetE
oughrouti
gspacea
dcrosstalkmargi

fMeettargetimpeda
ceMeetPIrequireme
tMeetDFMrulesMeethighspeedsig
alsISrequireme
tPrepregCoreSelectio
ImpacttracewidthImpactimpeda
ceTgrequireme
tI
sertio
lossrequireme
tPCBcost
Copperselectio
Poweri
tegrityPCBcost
fDefi
etheotherparametersMeetDFMrulesSymmetricco
structio
Totalthick
ess
Desig
Flow
Defi
eotherparameters
fImpeda
ceCalculatio
Si
gle
Desig
Flow
Impeda
ceCalculatio

fW1≥milW2milH2≥3H1T1
Impeda
ceCalculatio
Differe
tial
fW1≥milW2milH2≥3H1T1
Impeda
ceCalculatio
Otherco
structio
s
Desig
Flow
Impeda
ceCalculatio

QA
fr
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