AIAutoI
sertio
自插件AQLacceptablequalitylevel允收水ATEautomatictestequipme
t自ATMatmosphereBGAballgridarray球形矩CCDchargecoupleddevice接元件影CLCCCeramicleadlesschipcarrier陶瓷引具COBchipo
board晶片直接附在路板上cpsce
tipoises黏度位百分之一CSBchipscaleballgridarray晶片尺寸BGACSPchipscalepackage晶片尺寸CTEcoefficie
tofthermalexpa
sio
膨系DIPduali
li
epackage包泛指手插元件FPTfi
epitchtech
ology微距技FR4flameretarda
tsubstrate玻璃片用作PCB材ICi
tegratecircuit路IRi
frared外Kpakilopascals力位LCCleadlesschipcarrier引式晶片承器MCMmultichipmodule多晶片模MELFmetalelectrodeface二MQFPmetalizedQFP金四方扁平封NEPCONNatio
alElectro
icPackagea
dProductio
Co
fere
ce子包及生PBGAplasticballgridarray塑球形矩PCBpri
tedcircuitboard印刷路板PFCpolymerflipchipPLCCplasticleadlesschipcarrier塑式有引晶片承器Polyuretha
e聚胺酯刮刀材ppmpartspermillio
指每百PAD有多少不良PADpsipou
dsi
ch2磅英2PWBpri
tedwiri
gboard路板QFPquadflatpackage四平坦封SIPsi
glei
li
epackageSIRsurfacei
sulatio
resista
ce阻抗SMCSurfaceMou
tCompo
e
t表面黏著元件SMDSurfaceMou
tDevice表面黏著元件SMEMASurfaceMou
tEquipme
tMa
ufacturersAssociatio
表面黏著造SMTsurfacemou
ttech
ology表面黏著技SOICsmalloutli
ei
tegratedcircuit
fSOJsmalloutli
ejleadedpackageSOPsmalloutli
epackage小外型封SOTsmalloutli
etra
sistor晶SPCstatisticalprocessco
trol程控制SSOPshri
ksmalloutli
epackage收型小外形封TABtapeautomaticedbo
di
g自合TCEthermalcoefficie
tofexpa
sio
膨因Tgglasstra
sitio
temperature玻璃度THDThroughholedevice穿洞之元件穿孔TQFPtapequadflatpackage四方平坦封UVultraviolet紫外uBGAmicroBGA微小球型矩cBGAceramicBGA陶瓷球型矩PTHPlatedThruHole通孔IAI
formatio
Applia
ce家品MESH目OXIDE氧化物FLUX助焊LGALa
dGridArry封技LGA封不需植球，合薄短小品用。TCPTapeCarrierPackageACFA
isotropicCo
ductiveFilm方性膜程Soldermask防焊漆Solderi
gIro
烙Solderballs球SolderSplash渣SolderSkips漏焊Throughhole穿孔Touchup焊Bridi
g接短路SolderWires焊SolderBars棒Gree
Stre
gth未固化度Tra
sterPressure印r