223牛皮纸224粘结层225滑移226缺胶
ultraso
icclea
i
gsprayclea
i
galkali
edegreasi
goverflowdeio
izedwatertar
ish
190化学清洗191浮石灰（火山灰）192喷沙193去毛刺194机械抛光
chemicalclea
i
gpumicepwdersa
dblasti
gdeburri
gchemicalpolishi
g
bo
dstre
gthpulloffstre
gthpeelste
gthflexuralstre
gthelo
g
tio
torsioualstre
gth
201孔拉脱强度202弓曲203扭曲204弯度205挠曲破坏206弯曲能力207疲劳寿命
holepullste
gthbowtwistcamberflexuralfailurebe
dasilityfatiguelife

umericalco
tolNCcomputer
umerialco
trolCNCbackupe
trymaterialri
gcollarsha
kchiploadplowi
gresi
smearfoilburrglassfiberptotrusio
gougi
gdebrisbreakoutdrillpoi
terlaserviaholekruftpaperbo
di
glayerswimmi
gresi
starratio

227层间空洞228冲切229模压230刀模231白圈232喇叭孔233铣切234倒斜边235倒角236刻槽237V槽238缝纫孔239裁切线240靠模板241夹具242定位孔243定位特征244偏置定位
lami
atio
voidpu
chi
gdiestampi
gsteelrulediehaloi
gbugleholerouti
gbevelli
gchamferscori
gvcutsewi
gholetrimli
etemplatefixturei
dexi
gholetooli
gfeaturepolarzatio

f八、环保术语
245环境246环境因素247环境影响248污染预防249水污染250嗓声251排放物252废物处理253化学需氧量
2九54压滤、软板及其他术语
265印制线路板266半固化片267覆铜箔层压板
e
viro
me
te
viro
me
taspecte
viro
metimpacti
viro
me
tpollutio
waterpollutio
oiseefflue
twastetreatme
tchemicaloxyge
dema
dfilterpress
PCBpri
tedcircuitboardPreprcgPPCoppercladlami
ate
268挠性印制板
FPCflexiblepri
tedboard
269刚挠性印制板
FRPC（flexrigidpri
tedboard
270带状自动焊接
TABtapeautomatedbo
ki
g
271热风整平272有机助焊保护膜273自动光学检查仪274原始设备制造商
HOoStPaoirrgleav
eicli
sgolderabilitypArOesIearvuatotimveaticopticali
spectio
sOsEteMmorigi
alequipme
tma
ufactures
ULU
derwriters
275美国保险商实验室
Laboratories
276美国电子电路互连与封装协会IPC
277国际标准化组织
ISO
255生态平衡256层流257环境温度258湿度259相对湿度260渗析261渗透262离子交换263中和264沉淀
ecologicalequilibriumlami
arflowcrossflowambie
ttemperaturehumidityrelativehumiditydialysisosmosisio
excha
ge
eatralizatio
precipitatio
setti
g
278中华人必共和国标准GB
279聚酰亚胺挠性基材PIpolyimide
280聚酯挠性基材
Polyester
环氧聚酯玻璃纤维混
281合型基材
expoxyglasspolyesterfibers
282聚酰胺
Aramide
283聚四氟乙烯介质薄膜Teflo
铁弗龙）
284覆盖膜
Coverlay
285胶纸
Tape
286加强片
Stiffe
er
287垫片
backup
288粘结层289离型膜290离型纸
feltlayerRelear