一、品质缺陷常用术语
中文1外观检查2开路3短路4凹痕5凹陷6凸瘤7结瘤8擦花9缺损10痕迹11线路损坏12露铜13PAD损坏14电镀粗糙15蚀板不净16蚀板过渡17非金属毛刺18露纤维19纤维断裂20麻点和空洞21半润湿22渗出23造成原因24漏镀25摩擦26树脂凹缩27裂缝28金属箔裂缝29微裂纹30拐角裂纹
PCBVocabulary
英文visualexami
atio
ope
circuitshortcircuit
ickcircuitdisdow
bump
odulesscratchreducetraceliftedtracecircuitdamagedexposurecopperpaddamagedroughplati
gu
derethchi
goverethchi
g
o
materialburrsexposedfibersdisruptedfiberspitsa
dvoidsdewetti
gbleedi
grootcausedskipplati
gscrubresi
recessio
cracki
gcrackoffoilcrazi
gcor
ercrack
中文
英文
33阻焊油上PAD
soldermasko
pad
34绿油损坏
soldermaskdamaged
35阻焊油下有不明物foreig
materialu
dersm
36绿油不良
i
completesoldermask
37板污
co
tami
atio

38针孔
pi
hole
39漏孔
missi
ghole
40多孔
extrahole
41斜孔
splay
42气孔
blowhole
43孔被塞住
blockedhole
44金属入非通孔
metali
u
platedhole
45沉铜不良
i
completePTH
46孔内有污渍
holediscoloratio

47晕圈
haloi
g
48粉红圈
pi
kri
g
49起泡
blister
50夹杂物
i
cusio

51槽边有毛刺
excessiveburrsarou
dcavity
52白斑
measli
g
53粉点
meali
g
54漏啤
missi
gpu
chi
g
55锣板不良
poorrou
ti
g
56板料问题
materialproblem
57日期码错
wro
gdatecode
58铜镀层空洞
voidcopperplati
g
59印制插头边上的毛刺burrso
edgeboardco
tacts
60标记
pe
mark
61压痕
de
ti
de
tatio

62皱褶
wri
kle
f31分层32边缘精度
二、客户组装用术语
65表面组装技术66表面组装器件67通孔插装技术68自动元件插件69顺序贴装70同时贴装71流水线式贴装72芯片焊接73挠性板上直装芯片74浸焊75超声焊接76脉冲焊接77锡珠
78焊渣79残留物80真空吸锡法81焊料毛刺82接触脚83膏状焊料
三84酸性焊剂、电镀用术语
105镀层脆性106起皮107起泡108剥离109桔皮110针孔111孔隙率112内应力113硬度
delami
atio
edgedefi
itio

63渗渡64凿槽
exta
eousplati
ggouge
SMTsurfacemou
ttech
ologySMDsurfacemou
tdevicesTHTthroughholetech
ologyautomatedcompo
e
ti
sertio
seque
tialplaceme
tsimulta
eowsplaceme
ti
li
eplaceme
tdiesoleri
gCOFchipo
flexibledipsolderi
gultraso
icsolderi
gpulsesolderi
gsolderball
drossresiduepulsevacu
ti
removalicicleco
tacta
glesolderpastecreamsolderacidflux
brittle
esspeeli
gblisterspalli
gora
gepeelporesporosityi
ter
alstresshard
ess
85吸嘴86定心爪87贴装精度88焊接89再流焊90波峰焊91气相焊接92组装密度93混装技术94引线95平r